Liper Use Flip-Chip COB Technology for Superior Lighting Quality and Long-Term Durability

Traditional face-up COB adopts wire-bonding technology: LED chips face upward, with tiny fine wires linking chip electrodes to the substrate for electrical conduction. This classic mature process features affordable production costs, yet it carries inherent limitations. Bonding wires block roughly 20% to 25% of the luminous area, lowering luminous efficiency and causing uneven colour temperature. Worse still, heat must travel through wires and encapsulant before dissipating, leading to high thermal resistance and accumulated heat. Under long-hour operation, thermal expansion and contraction easily trigger wire breakage, virtual soldering and rapid light decay, making it only suitable for stable indoor low-power scenarios with short daily usage.

In contrast, Liper’s widely adopted flip-chip COB turns LED chips upside down. Electrodes sit on the chip rear side and connect directly to the substrate via solder bumps, completely eliminating bonding wires. This design shortens the heat conduction path drastically, delivering excellent thermal dissipation and effectively lowering junction temperature during continuous high-power operation. Without wire obstruction, luminous efficiency rises by 15%–20%, bringing uniform light spots and stable colour consistency. Free from wire failure risks, flip-chip COB boasts outstanding shock resistance, moisture tolerance and temperature adaptability, perfectly fitting outdoor floodlights, industrial high-bay lamps, commercial spotlights and round-the-clock operational lighting projects.

Face-up COB vs Flip-chip COB Comparison